- Thread starter Derick2k
- Start date
Sp33dFr34k
Champion
So we can sign you up for 3 CPS1 multi's?
raidenmaniac1
Enthusiast
I ll take two w/ extra cheeeese please
MoppelTheWhale
Grand Master
i would also buy one 
owlnonymous
Student
Very much so.
CoinFeeder
Professional
Mos' definitely! +1
UnholySpectacle
Beginner
I would buy one for sure.
Scarletspeedstr
Student
Complete the trilogy. I need this.
dreday12203
Beginner
Would buy 3. That way I can have them run in all 3 of my dynamo cabs.
A
Apocalypse
There's the exact same ASIC on the bootleg CPS1 game I got from Blackfish with the exact same reference:Since we are talking about A boards, here is a funny thing for you
And the bootleg CPS-A-01 asic...
It is hard to believe that someone took the necessary time & effort to reproduce these back in the day...
It is not working though but I'll try the ASIC in one of my cps1 A boards...
I've transplanted those 2 chips on OG CPS1 hardware and can confirm:Here's a clearer pic of the 2 large chips and the socketed chips, I have rotated the image but its still a little hard to read so I will take a better image of them tonight. As far as game play and Sprite defects I'll also give it a better playthrough tonight. I didn't have time to actually play it over the weekend. Hope this is of interest @Asure and @Apocalypse
- 27C633 is a perfect replacement for CPS-B-21 (found on C boards) with default keys
- 27C634 is a perfect replacement for CPS-A-01 (found on A boards)
However I don't think they were hijacked stock before reference printing as chip package is slightly different from the OG chips (different angles and manufacturing marks).
Maybe "stolen" dies?
J
jassin000
My guess is some whole wafers went "missing" from the original factory.
I don't believe single die would have made it past the dice&sort operations as these are often are done at the same factory providing the finished module.
As pointed out these modules are different.
When my company ships completed wafers out for example, we'll test 'em and then tape mount 'em.
The receiving module factory dices/cuts our mounted wafer, then using the verified test map I generate, pulls any/all good die out for wirebonding/module.
