Recent content by ARIKAHistorian

This is the context I meant I assume this strategy wouldn’t work in your guy’s case? With your boards?

No I don’t have a unit currently yet but I just meant that because Phil went about getting the board to work in a different way I assume based on the thread information and conversation. that contacting him via his website wouldn’t help. Yeah I figured that Phil was on here…

Ok. I was considering reaching out to Phil online via the contact form on his website but I’m guessing that wouldn’t help based on the context I’m picking up?

Yeah the only thing I see is industrial level solutions…

Ok so a couple thoughts occur to me. If the architecture utilizes some form of IBM tech are there similar tech that can be found that have a similar type of technology to it? If so you could look at the internals of those potentially? Is the actual ide spinning when powered up? Essentially this...

Hmm I’m trying to peruse Phil’s list of pcb repairs on his site but cannot find documents for fighting wu-shu and you said he got it working? When exactly was that I just ask because I’m trying to look into his entries by date. I mean I found the YouTube video he made on it.

Just curious are you all using the original arcade power supply?

Thank you so much I’ll look into this!

I think it released on Taito type x. Not x2 correct? I’m looking for the non NesiCaxlive version released in 2009. I know I’m looking for a needle in a haystack but that’s ok. I know it will take a while I tracked one to G-Front in Akihabara but that was a ghost list that hasn’t been updated...

I see. And the heat causes everything to expand when in use and contract when not in use.

Can’t you dial in the exact amount of tension you need to make contact with the chip?

So it’s a bunch of boards and sub boards stacked on top of each other right? 1 small misalignment can trigger the E1 system error. Thermal pads might help the system is cooking itself and the temperature check is wrong hmm… nylon nuts and bolts might address the leaf springs problem.

nylon bolts, nuts, and non-conductive washers. This allows them to manually dial in the exact amount of "clamp" pressure needed to keep the heatsink tight against the chip. Modern Thermal Pads: Instead of liquid paste, they might use high-quality thermal pads. These are "squishy" and can bridge...

Hmm… learning about ball grid array issues.

I did some ai research and feedback and it mentioned something about thermal paste and non conductive shims and standoffs. I think