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Preparing a Hikaru BGA Chip for Re-installation

I've been trying my hand at BGA rework, not Hikaru hardware but Naomi which is pretty similar.

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Modified Jovy 7500.

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Microscope camera to watch the chip drop into place. :D

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How is there no trace of solder on the chip at all, that's crazy. It was obviously never soldered properly from the factory =O, shame you're in the states that would be a fun one.
 
Ace` said:
How is there no trace of solder on the chip at all, that's crazy. It was obviously never soldered properly from the factory
Click to expand...
that is 100% the problem with every Hikaru produced as far as I know.
from what I've heard In production they failed to properly prep the chip surfaces so the chip separates from the solder quite easily.

I think when mounted inside of a cab and shipped they're probably find because any shock from the cab being rolled over bumps isn't going to cause shear stress across the BGA solder, but when the PCBs are removed from the cab and shipped, all bets are off, if it's even set down roughly on it's side that giant heat-sync is going to rip the chip right off of the board from the sheering force.

most of the survivors I've seen have had GOBS of hot-glue poured around all of the chips.
 
twistedsymphony said:
from what I've heard In production they failed to properly prep the chip surfaces so the chip separates from the solder quite easily.
Click to expand...

Yup ^ oxidation of pads, lack of heatsink structural support, concussive damage... this is stuff Ken has mentioned in various posts over at KLOV.

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I'd love to have a hikaru someday.
But someone has to be willing to dedicate a setup to fixing them, and then a multi is viable.
I am certain there's money in it, there's more parts boards than working ones laying around.
My concern is how many got thrown away.
 
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