I'm trying to make my own NEO-BUF using TSSOP20 because my eyes can't handle QFN anymore.
The story so far...
NEO-BUF has a 0.8mm pitch. I used square pads with a diameter of 0.6mm and a drill of 0.3mm.
The outline in the dimension layer is 0mil and it is positioned in the center of the hole.
In Eagle the board looks fine. But in other software the pads are almost gone.
I've attached a picture with the comparison.
What's the correct method for the outline for half vias/pads? If I move the outline 5mil on the outside, on some software the half pads looks decent.
Will JLCPCB do this board without selecting the "castellated holes" option? That will increase the price a lot...
The story so far...
NEO-BUF has a 0.8mm pitch. I used square pads with a diameter of 0.6mm and a drill of 0.3mm.
The outline in the dimension layer is 0mil and it is positioned in the center of the hole.
In Eagle the board looks fine. But in other software the pads are almost gone.
I've attached a picture with the comparison.
What's the correct method for the outline for half vias/pads? If I move the outline 5mil on the outside, on some software the half pads looks decent.
Will JLCPCB do this board without selecting the "castellated holes" option? That will increase the price a lot...